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Automatic vertical convection thermal system

Designed for coating processes, post-dispensing backend processes, and intended to address operational needs.
SOLUTIONS

→ CURING

Save energy and floor space

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Download Datasheet

Unique concept

CONFIGURATION FLEXIBILITY

  • Photoelectric sensor.
  • Lifting.
  • Perfect width adjustment mechanism.
  • Fiber optic sensor.
  • Dual lane option.

PRODUCTIVITY

  • Improving temperature uniformity.
  • Unique horizontal + up & down air.
  • Embedded trend analysis.
  • High thermal efficiency and uniformity.
  • Heating layers: up to 65.
  • Dual lane option.
  • 130 positions.

TRACEABILITY (SMARTBOX OPTION)

  • Process tracker.
  • Live process parameters log.
  • Embedded trend analysis.

OPTIMIZATION

  • Floor space & facility savings.
  • Energy efficient.
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Features

  • PCB size: 600×500 mm (LxW).
  • Conveyor: Bottom and return.
  • Distance between slots: Adjustable: ex. 25 mm (64 layers) – 75 mm (16 layers).
  • Numbers of slots: front 32 cages, rear 32 cages.
  • Weight: More than 5 kg per layer.
  • Heating control: PID closed-loop control + high-frequency pulse.
  • Photoelectric sensor: Detects the PCB position.
  • Fiber optic sensor: Detects the PCB position.
  • Lifting limit: Fiber detection.
  • Width-adjusting device: The movable rail is used to adjust the width.
  • Safety: CE-compliant safety measures and protection devices.
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Application

Preheat and cure of underfill, potting, glue, corner bonding, thermal paste, gap filler, coating, ink, etc.

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