Laser cutting machine
The LS-NUN Laser Depaneling System offers advanced PCB board routing and cutting using a laser source. It supports hybrid PCB boards, including FPCB and Rigid-Flex PCB, ensuring minimal particle generation due to its non-contact cutting method. This system delivers high cutting quality, significantly reducing cut widths from 100µm to under 30µm. It also supports complex PCB shapes.
SOLUTIONS
Advantages
The LS-NUN system provides a stress-free, form-cut-free, and tooling-cost-free solution for PCB cutting. Its non-contact method ensures superior cutting quality, making it an optimal choice for modern PCB manufacturing needs.
Laser depaneling system
Different types of lasers according to application:
LS-UTG: UTG (ultra-thin glass) cutting machine /
Laser Type: IR Laser 20W
- Stage: 300 x 300 mm vacuum chuck
- Stress and crack free process
- Cutting thickness: 30um ~ 100um
- Support round cutting
- Bending test: 1r, 400k
LS-QTZ: Quartz tube rod cutting machine
Laser Type: IR Laser
- Chip size: <30um
- No need cleaning, dry and fire polishing process
- Cutting thickness: ~6t
- Stress, crack and particle free process
LS Laser Type: UV Laser
- Cutting thickness: ~800um
- Cutting width: <100um
- Chip size: <30um
- Stress and crack free process-WFR: wafer cutting machine
Features
- Use various laser sources such as UV, green, IR, etc.
- Cutting materials: FR4, FPCBs, Kapton, etc.
- Thickness up to 1.2mm for FR4 PCB.
- Pin table, production fixture.
- Full-cut process supports high-population PCB panels.
- Best cutting quality (minimizes charring).
- Clean process with particle and fume removal.
